Reflow Soldering Oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards (PCB).
According to our (Global Info Research) latest study, due to COVID-19 pandemic, the global Reflow Soldering Oven market size is estimated to be worth US$ 368.3 million in 2021 and is forecast to a readjusted size of USD 469.6 million by 2028 with a CAGR of 3.5% during forecast period 2022-2028.
The product average price declined in the past few years due to the technology development, the average price will keep the trend in the few future years due to increasing mature manufacturing technology and lowing cost of raw materials.